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EMIF02-MIC01F2
2-line IPADTM, EMI filter including ESD protection
Features

2-line symetrical low-pass filter Lead-free package High-density capacitor High-efficiency EMI filtering Very small PCB footprint: 1.42 mm x 1.92 mm Very thin package: 0.65 mm High-efficiency ESD suppression (IEC 61000-4-2 level 4) High reliability offered by monolithic integration Figure 1.
Flip Chip 11 bumps
Pin configuration (bump side view)
Complies with the standards:
4
3
2
1 A B C
IEC61000-4-2 Level 4 on inputs and outputs - 15 kV (air discharge) - 8 kV (contact discharge)
Application
Mobile phones (differential microphone filtering and ESD protection).
Figure 2.
Schematic
A4
Meas GND GND GND
Description
The EMIF02-MIC01F2 is a highly integrated device designed to suppress EMI / RFI noise for microphone line filtering.
B4
GND GND
C5
Vcc
A2
C1 R1 To Mic C3 R3 R5
B1
to pre-amp C1codec C4 R4 R6
The EMIF02-MIC01F2 Flip Chip packaging means the package size is equal to the die size. This is why the EMIF02-MIC01F2 is a very small device. Additionally, the filter includes an ESD protection circuit to prevent damage to the protected device when subjected to ESD surges up to 15 kV.
C4
C2
R2
C2
GND GND GND GND GND GND
C6
A3,B2,B3,C3 are ground pins
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 6
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www.st.com 7
Electrical characteristics
EMIF02-MIC01F2
1
Electrical characteristics
Table 1.
Symbol VPP Tj Top Tstg
Absolute maximum ratings (Tamb = 25 C)
Parameter ESD IEC 61000-4-2, input and output pins - air discharge ESD IEC 61000-4-2, in put and output pins - contact discharge Junction temperature Operating temperature range Storage temperature range Value 15 8 125 -40 to +85 -55 to +150 Unit kV C C C
Table 2.
Symbol VBR IRM VRM VCL Rd IPP Symbol VBR IRM
Electrical characteristics (Tamb = 25 C)
Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Test condition IR = 1 mA per line VRM = 3 V per line 0.8 1.0 50 1.00 2.20 Min 14 Typ Max 18 0.5 1.2 Unit V A nF k k
C1, C2, C3 VLINE = 0 V, VOSC = 30 mV, F = 1 MHz C4, C5, C6 R1, R2 R3, R4 R5, R6 Tolerance 5 % Tolerance 5 % Tolerance 5 %
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EMIF02-MIC01F2
Electrical characteristics
Figure 3.
dB
10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 100 k
Filter response
Tj = 25 C
Figure 4.
10 0 -10 -20 -30
Analog crosstalk
Tj = 25 C
dB
Line B4/B1
-40 -50 -60 -70 -80
C1/B4
Line C4/C1
1.0 M 10.0 M 100 M 1.0 G
-90
F (Hz)
F (Hz) 10.0 G
-100 100 k
1.0 M
10 M
100 M
1.0 G
10 G
Figure 5.
ESD response to IEC 61000-4-2 (+15 kV air discharge) on output (VOUT)
Figure 6.
ESD response to IEC 61000-4-2 (-15 kV air discharge) on output (VOUT)
10 V/div
10 V/div
20 ns/div
20 ns/div
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Ordering information scheme
EMIF02-MIC01F2
2
Ordering information scheme
Figure 7. Ordering information scheme
EMIF
EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 2 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, Pitch = 500 m, Bump = 310 m
yy
-
xx zz
Fx
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 8. Flip Chip dimensions
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EMIF02-MIC01F2
Ordering information
Figure 9.
Footprint
Figure 10. Marking
Copper pad Diameter: 250 m recommended, 300 m max
Dot, ST logo
Solder stencil opening: 330 m
E
Solder mask opening recommendation: 340 m min for 300 m copper pad diameter
xx = marking z = manufacturing location yww = datecode (y = year ww = week)
xxz y ww
Figure 11. Flip Chip tape and reel specification
Dot identifying Pin A1 location 4 0.1 O 1.5 0.1
1.75 0.1 3.5 0.1
1.56
0.73 0.05
All dimensions in mm
8 0.3
STE
STE
STE
2.02
xxx yww
User direction of unreeling
xxx yww
xxx yww
4 0.1
4
Ordering information
Table 3. Ordering information
Marking GB Package Flip Chip Weight 3.8 mg Base qty 5000 Delivery mode Tape and reel (7")
Order code EMIF02-MIC01F2
Note:
More packing information is available in the application notes: AN1235: "Flip Chip: package description and recommendations for use" AN 1751: "EMI filters: Recomendations and measurements"
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Revision history
EMIF02-MIC01F2
5
Revision history
Table 4.
Date Sep-2004 09-Feb-2006 06-Oct-2006 17-Apr-2008
Document revision history
Revision 3 4 5 6 Previous issue. Added ECOPACK statement. Updated graphics to current standards. Reformatted to current standards. Updated characteristic curves, removed Aplac information and updated tape and reel pocket dimensions. Updated ECOPACK statement. Updated Figure 7, Figure 8 and Figure 11. Reformatted to current standards. Changes
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EMIF02-MIC01F2
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